TEConnectivity

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 TE Connectivity


  • FPGA with Dual zQSFP+ Connectors Modem

  • Created: Mar 25, 2015

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Summary

Telecommunications, data center and networking markets require a high-speed, high-density connector. Today, connectors incorporate thermal management component (TMC) in a connector module that basically provides heat sinking and dissipation functions. TE Connectivity's 1551892-1 z-Quad Small Form-factor Pluggable Plus (zQSFP+) Interconnect System combines excellent signal integrity, electromagnetic interference protection and thermal cooling.


The modem is an FPGA with dual zQSFP+ connectors offering 100 Gbps performance (Port 0 at 100G, Port 1 up to 40 Gbps) via the front panel. The module is compliant to the AMC.1, AMC.2, and/or AMC.4 specification. It has an on-board, reconfigurable FPGA, which interfaces directly to the AMC FCLKA and TCLK A-D. The FPGA has interfaces to four DDR3 memory channels (32-bit wide each) with 1 GBytes per channel and a 4 GBytes total size. This allows for large buffer sizes to be stored during processing as well as for queuing the data to the host. The on-board quad-core P2040 can run at 1.2GHz with 2 GBytes of DDR3, 128 Mbytes of Boot Flash, and a 32 GByte SD Card. The PPC has an x4 PCIe interface to the FPGA in addition to its local bus. The PPC has its dual GbE routed to ports 0 and 1 of the AMC.


TE Connectivity offers the zQSFP+ connectors as the next generation of high-speed I/O devices in the QSFP family. Featuring four channels of high-speed differential signals with data rates ranging from 25 Gbps up to 40 Gbps. The zQSFP+ connectors and cage assembly support 100 Gbps (4x25 Gbps) Ethernet and 100 Gbps 4X InfiniBand Enhanced Data Rate (EDR) requirements. The high-temperature, thermoplastic housing and enhanced EMI cage provide excellent thermal performance/EMI protection fully backwards compatible with existing QSFP+ optical modules and cable assemblies. The zQSFP+ connectors enable designers to introduce parts for new and future innovations while maintaining compatibility with the standards and speeds currently on the market.

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