Low Power 12.5Gbps 2 x 2 Crosspoint Switch using Z-PACK TinMan
Created: Mar 24, 2015
No description available.
The requirement of a reliable high-density connector is important to applications that deal with high-speed Internet connection. This design features a TE connectivity connector that offers right angle receptacle for the different types of daughter cards interfaced with their main backplane. It has low crosstalk and high throughput performance levels because ground contacts are positioned within each column of the connector that is combined with unique contact lead frame arrangements. It is built with a dual point of contact mating interface and compliant pin interface to the printed circuit board in which reliability of the design is assured. It has also redundant design for every signal contact.
These networking system components are comprised of optical backplane and switch/line card. In the optical backplane, it holds a high-speed connection that pass through a connector. This connector is a Z-PACK TinMan that provides the right-angled connection of the system with minimal losses. It provides the 12.5Gbps speed capability to the system that is distributed through its optical modules. The switch/line card uses a MAX3841 low power, 12.5Gbps, 2 x 2 crosspoint switch IC that operates with the Application-Specific Integrated Circuit (ASIC) components.
The design is applicable to network communications where high-density connections are expected. It is useful to server setups that elbows and joints of wiring and circuiting are always part of the design optimization.