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  • Dual LIN Physical Layer Interface

  • Created: May 06, 2015

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Summary

Local interconnect network or commonly known as LIN is a serial correspondence protocol intended to bolster automotive networks in conjunction with Controller Area Network (CAN). As the least level of a hierarchical system, LIN enables cost-effective communication with sensors and actuators when all the highlights of CAN are not needed.

The MC33663 product line integrates two-physical layer LIN bus dedicated to automotive LIN sub-bus applications. The MC33663LEF and MC33663SEF devices offer normal baud rate (20kbps) and the MC33663JEF slow baud rate (10kbps). Both devices integrate fast baud rate (above 100kbps) for test and programming modes. They present excellent ElectroMagnetic Compatibility (EMC) and radiated emission performance, ElectroStatic Discharge (ESD) robustness and safe behavior, in the event of LIN bus short-to-ground or LIN bus leakage during low-power mode.


The aid of LIN technology allows us to create conveyed systems inside the car. LIN can possibly cover all applications, which can't be straightforwardly associated with CAN due to high cost. Hence, it is important to convey the cost of LIN modules to a level, which is far underneath CAN. Up to now this was just conceivable with state machines. That kind of solution is efficient, robust and modest, however it has the disadvantage that it's only proven for one application and subsequently not adaptable. The changes are hard to actualize and must be visualized with a high exertion and advancement time. The conventional MCU architectures are adaptable, however LIN and other applications impact one another. These solutions don't cover most applications at the cost level that we need for LIN.

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